Wafer Appearance Inspection Equipment (Before Dicing)
Selectable image resolution tailored to inspection accuracy! Achieving fast and high-precision inspections.
The "Wafer Appearance Inspection Device (Before Dicing)" is a device capable of inspecting appearance defects that occur in the wafer process with high speed and high precision. Image resolution can be selected according to inspection accuracy (macro inspection with a resolution of approximately 10μm or higher). Additionally, the viewer software includes features such as inspection result map display, NG chip magnification display, and defect classification display (defect items/total inspections/OK/NG). 【Features】 ■ Multifunctional image inspection software Hu-Dra ■ Capable of inspecting appearance defects occurring in the wafer process ■ Auto-focus function (optional) ■ Marking error check function for all units (optional) ■ ID reading and mapping data output function (optional) *For more details, please refer to the PDF document or feel free to contact us.
- 企業:ヒューブレイン
- 価格:Other